Flip chip MPU module on high performance printed circuit board "aLIVH"

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 520-525

  Shiraishi, T ^a   Amami, K ^a   Bessho, Y ^a   Sakamaoto, K ^a   Eda, K ^a   Ishida, T ^a   Fukuoka, K ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

ALIVHTM; MCM (Multi Chip Module); MPU (Micro Processor Unit); SBBTM; technique

Indexed keywords

BONDING; CARBON DIOXIDE LASERS; CHIP SCALE PACKAGES; LSI CIRCUITS; MICROPROCESSOR CHIPS; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SUBSTRATES; TIMING CIRCUITS;

ALIVHTM; CONDUCTIVE ADHESIVE; CONDUCTIVE PASTES; FLIP CHIP BONDING; INTERCONNECTION TECHNOLOGY; SBBTM; STUD BUMP BONDING; TECHNIQUE;

FLIP CHIP DEVICES;

EID: 84966652508     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670835     Document Type: Conference Paper

References (6)

1. Y. Bessho, et al., "Advanced Stud-Bump-Bonding Technique for High Density MCM, Proceedings of 1993 Japan IEMT Symposium, PP.362-365, June 1993.
2. T. Shiraishi, et al., "Stud-Bump Bonding Technique onto an advanced Organic Substrate for MCM-Ls", Denver, Colorado the fjth International Conference and Exhibition on Multi chip Module, Proceedings of PP.109-114, April 1997.
3. T. Nishii, et al., "Performance of Any Layer IVH structure Multi-layered Printed Wiring Board", Ohmiya, Japan IEMT Symposium Proceedings of PP.93-96, December 1995.
4. Y. Hirano, et al., Tokyo, Japan The 11 JIPC Annual Meeting, Proceedings of PP.27-28, March 1997.
5. N. Shimoyama, et al., "Device degradation induced by stud bumping above the MOS-FETs(1)" Akita, Japan The 5gth Japan Society of Applied Physics, Extended Abstracts No.2 of PP.745, October 1997.
6. M. Itagaki, et al., "A Cofired Bump Bonding Technique for Chip-Scale-Package Fabrication Using Zero X-Y Shrinkage Low Temperature Cofired Ceramic Substrate", Philadelphia Pennsylvania, The 1997 International Symposium on Microelectronics, Proceedings of PP.685-690, October 1997.