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Advanced Packaging
Volumn 9, Issue 9, 2000, Pages
Thicker film photodefinable polyimides
Author keywords

[No Author keywords available]
Indexed keywords

EID: 0002833169     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article
Times cited : (3)
References (3)
  • 1
    • 0019013811 scopus 로고
    • A Silicon and Aluminum Dynamic Memory Technology
    • May
    • L. Larson, "A Silicon and Aluminum Dynamic Memory Technology," IBM Journal of Research & Development, Vol. 24, Number 3, May 1980, pp. 268-282.
    • (1980) IBM Journal of Research & Development , vol.24 , Issue.3 , pp. 268-282
    • Larson, L.1
  • 2
    • 0040962809 scopus 로고    scopus 로고
    • Reducing Polyimide Cure Time for MCM-D
    • November
    • W. Wilkens and C. Schuckert, "Reducing Polyimide Cure Time for MCM-D," Advanced Packaging, November 1999, pp. 42-46.
    • (1999) Advanced Packaging , pp. 42-46
    • Wilkens, W.1    Schuckert, C.2
  • 3
    • 0033341755 scopus 로고    scopus 로고
    • Single Mask Wafer Overcoat Process Using Photodefinable Polyimide
    • October
    • S. Hall and C. Schuckert, "Single Mask Wafer Overcoat Process Using Photodefinable Polyimide," Solid State Technology, October 1999, pp. 95-96.
    • (1999) Solid State Technology , pp. 95-96
    • Hall, S.1    Schuckert, C.2

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.