Reducing polyimide cure time for MCM-D

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Volumn 8, Issue 10, 1999, Pages 42-46

  Wilkins, Wendy ^a   Schuckert, Craig ^b  

^a New Technology Lab   (United States)

^b HD MicroSystems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040962809     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (2)

1. John C. Coburn et al, "Thermal Curing in Polyimide Films and Coatings," Polyimides Fundamentals and Applications (ed. M. Ghosh et al) 1996, pp 207-47.
2. Raymond Byrnes, Shelly Danielson, Joel Ficke, "Methods for Bow Reduction on Thin Film Interconnected Substrates," WSI Report #8, January 4, 1994.