Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 21, Issue 1, 1998, Pages 57-65

  Gamota, Daniel ^a   Melton, Cindy ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ENCAPSULATION; FLIP CHIP DEVICES; RELIABILITY; SOLDERING; SUBSTRATES; TESTING;

DIRECT CHIP ATTACH; FLIP CHIP ON BOARD; FLUXING UNDERFILL; REFLOW; REFLOWABLE MATERIAL; UNDERFILL;

SURFACE MOUNT TECHNOLOGY;

EID: 0031653238     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.670029     Document Type: Article

References (9)

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4. D. Gamota C. Melton Encapsulant materials systems for flip chip on board assemblies: Addressing manufacturing issues Proc. NEPCON W. 24 34 1997 CA, Anaheim
5. D. W. Wang K. I. Papathomas Encapsulant for fatigue life enhancement of controlled collapse chip connection (C4) IEEE Trans. Comp., Hybrids, Manufact. Technol. 16 Dec. 1993 33 6773 273686
6. F. Nakano T. Soga S. Amagi Resin-inserting effect on thermal cycle resistivity of flip-chip mounted LSI devices Proc. ISHM 536 541 1997
7. H. Lee K. Neville Handbook of Epoxy Resins 1967 McGraw-Hill New York
8. D. Suryanarayana T. Y. Wu J. A. Varcoe Encapsulants used in flip-chip packages IEEE Trans. Comp., Hybrids, Manufact. Technol. 16 Dec. 1993 33 6773 273685
9. R. Jackson P. Carnevali J. Frazier Finite-element modeling of encapsulated flip-chip packaging assemblies Proc. ISHM 82 85 1991