Probing the Mechanism of Electroless Gold Plating Using an EQCM II. Effect of Bath Additives on Interfacial Plating Processes

Journal of the Electrochemical Society

Volumn 148, Issue 6, 2001, Pages

  Sargent, Anita ^a   Sadik, Omowunmi A ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000511738     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1370963     Document Type: Article

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