Rapid substitution of gold for aluminum metallization on integrated circuits

Journal of the Electrochemical Society

Volumn 144, Issue 3, 1997, Pages 1070-1072

  Krasopoulos, Anthony V ^a,c   Li, Jing ^a   Josowicz, Mira ^a,b   Janata, Jiri ^a,b  

^a PACIFIC NORTHWEST NATIONAL LABORATORY   (United States)

^b ELECTROCHEMICAL SOCIETY

^c Washington State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; GOLD; METALLIZING; NICKEL; OHMIC CONTACTS; PLASMA ETCHING; SOLID STATE DEVICE STRUCTURES; SUBSTITUTION REACTIONS;

SOLID STATE CHEMICAL MULTISENSOR CHIPS;

ELECTROLESS PLATING;

EID: 0031099610     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837533     Document Type: Article

References (10)

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10. M. Pourbaix, Atlas of Electrochemical Equillibria in Aqueous Solutions, p. 173, National Association of Corrosion Engineers, Houston, TX (1974).