Thermomechanical study of AlCu based interconnect under pulsed thermoelectric excitation

Journal of Applied Physics

Volumn 81, Issue 3, 1997, Pages 1157-1168

  Phan, T ^a   Dilhaire, S ^a   Quintard, V ^a   Lewis, D ^a   Claeys, W ^a  

^a UNIVERSITÉ DE BORDEAUX   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000240531     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.363985     Document Type: Article

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