Effects of collimator aspect ratio and deposition temperature on copper sputtered seedlayers

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 17, Issue 4, 1999, Pages 1898-1903

  Cooney, E C ^a   Strippe, D C ^a   Korejwa, J W ^a   Simon, A H ^a   Uzoh, C ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONFORMALITY; DEPOSITION TEMPERATURES; DUAL DAMASCENE STRUCTURES; ELECTRICAL TESTING; FILM STRUCTURE; SEED LAYER; VIA CHAIN; VIA RESISTANCE; WAFER TEMPERATURE;

COPPER; OPTICAL INSTRUMENTS;

ASPECT RATIO;

EID: 0000200848     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581701     Document Type: Conference Paper

References (6)

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