Characterization of w films on si and sic>2/si substrates by X-Ray diffraction, AFM and blister test adhesion measurements

Microscopy Microanalysis Microstructures

Volumn 8, Issue 4-5, 1997, Pages 261-272

  Bosseboeuf, Alain ^a   Dupeux, Michel ^a   Boutry, Mathilde ^a   Bourouina, Tarik ^a   Bouchier, Daniel ^a   Débarre, Dominique ^a  

^a UNIVERSITÉ PARIS SACLAY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000025505     PISSN: 11542799     EISSN: None     Source Type: Journal    
DOI: 10.1051/mmm:0199700804-5026100     Document Type: Article

References (21)

1. Li J.-G., Mat. Chem. Phys. 47 (1997) 126-145.
2. Jensen H.M., Eng. Fract. Atech. 40 (1991) 475-486.
3. Hohlfelder R.J., Vlassak J.J., Nix W.D., Luo H. and Chidsey C.E.D., Mat. Res. Soc. Symp. Proc. 356 (1995) 585-590.
4. Mamor M., Dufour-Gergam M., Finkman L., Tremblay G., Meyer F. and Bouziane K., Appl. Surf. Sci. 91 (1995) 342-346.
5. Hohlfelder R.J., Luo H., Vlassak J.J., Chidsey C.E.D. and Nix W.D., Mat. Res. Soc. Symp. Proc. 436 (1997) 115-120.
6. Sizemore J.T., Kohlfelder R.J., Vlassak J.J. and Nix W.D., Mat. Res. Soc. Symp. Proc. 383 (1995) 197-207.
7. Bromley E.I., Randall J.N., Flanders D.O. and Mountain R.W., J. Vac. Sci. Technol. B l (1983) 1364-1366.
8. Allen M.G., Mehregany AI., Howe R.T. and Senturia D., Appl. Phys. Lett. 51 (1987) 241-243.
9. Bonnotte E., Delobelle R, Bornier L., Trollard B. and Tribillon G., J. Phys. III France 5 (1995) 953-983.
10. Tabata O., Kawahata K., Sugiyama S. and Igarashi L, Sensors Actuators A 20 (1989) 135-141.
11. Small M.K., Vlassak J.J., Powell S.F., Daniels B.J. and Nix W.D., Mat. Res. Soc. Symp. Proc. 308 (1993) 159-164
12. Paviot V.M., Vlassak J.J. and Nix W.D., Mat. Res. Soc. Sijmp. Proc. 356 (1995) 579-584.
13. Maier-Schneider D., Maibach J. and Obermeier E., J. Microelectromech. Syst. 4 (1995) 238-241.
14. Mamor M., Étude de diodes Schottky tungstène sur des alliages SiGeC élaborés par RTCVD, Doctorate thesis, University Paris XI, Orsay (1996).
15. Carter G., J. Phys. D. Appl. Phys. 27 (1994) 1046-1055.
16. Zaouli M., Lebrun J.L. and Gergaud P., Surf. Coatings Tcchn. 50 (1991) 5-10.
17. Zhao J.P., Wang W., Chen Z.Y., Chang S.Q., Shi T.S. and Liu X.Y., J. Phys. D: Appl. Phys. 30 (1997) 5-12.
18. Boutry M., Etude de microdispositifs de test pour la caractérisation des propriétés mé caniques de films minces métalliques, Doctorate Thesis, Université Paris XI, Orsay (1997).
19. Boutry M., Bosseboeuf A. and Coffignal G., Characterization of residual stress in metallic films on silicon with microinechanical devices, Proc. SPIE-Micromachining and microfabrication, Austin (USA) (1996) pp. 126-134.
20. Sizemore J., Stevenson D.A. and Stringer J., Mat. Res. Soc. Symp. Proc. 308 (1993) 165-170.
21. Consiglio R., Von Stebut J. and Badawi K., poster communication, national meeting "Interfaces et Multi-Matériaux" (I2M), C.N.R.S.- E.N.S.A.M., Aix-en-Provence (France) May 26-28, 1997.