Innovative flexible and accurate packaging technique suited to fabricate low cost micro optoelectronic modules

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 26-32

  Scussat, M ^a   Wursch, A ^a   Clavel, R ^a   Salathe, R P ^a  

^a ISR IOA   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRON DEVICE MANUFACTURE; ELECTRONICS PACKAGING; LASER APPLICATIONS; MICROELECTRONICS; MULTICHIP MODULES; OPTICAL DESIGN; SOLDERING; SURFACE MOUNT TECHNOLOGY; THREE DIMENSIONAL;

HIGH ATTACHMENT PRECISION; LASER SOLDERING REFLOW PROCESS; MICRO OPTOELECTRONICS MODULES; THREE DIMENSIONAL MINIATURIZED OPTICAL SURFACE MOUNTED DEVICE;

OPTOELECTRONIC DEVICES;

EID: 0034476241     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)