Reduction of semiconductor process emissions by reactive gas optimization

IEEE Transactions on Semiconductor Manufacturing

Volumn 17, Issue 4, 2004, Pages 483-490

  Vartanian, Victor ^a   Goolsby, Brian ^a   Chatterjee, Ritwik ^a   Kachmarik, Rick ^a,b   Babbitt, Dan ^a   Reif, Rafael ^c   Tonnis, Eric J ^d   Graves, David ^e  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c Department of Electrical Engineering and Computer Science   (United States)

^d LAM RESEARCH CORPORATION   (United States)

^e University of California   (United States)

Author keywords

CVD; Environmental testing; Fourier spectroscopy; Plasma materials processing applications; Semiconductor device manufacture

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ENVIRONMENTAL TESTING; ETCHING; FLUORINE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MOLECULAR WEIGHT; OPTIMIZATION; POLYMERIZATION; SEMICONDUCTOR DEVICE MANUFACTURE; THERMODYNAMIC STABILITY;

FOURIER SPECTROSCOPY; PERFLUOROCOMPOUND (PFC) EMISSIONS; PLASMA MATERIALS-PROCESSING APPLICATIONS; REACTIVE GASES;

PARTICULATE EMISSIONS;

EID: 9144253353     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.837004     Document Type: Article

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