Microthermoforming of flexible, not-buried hollow microstructures for chip-based life sciences applications

IEE Proceedings Nanobiotechnology

Volumn 151, Issue 4, 2004, Pages 163-166

  Truckenmuller R ^a   Giselbrecht, S ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPHORESIS; FABRICATION; GLASS TRANSITION; HEATING; PERFORMANCE; POLYSTYRENES; PRESSURE EFFECTS; SURFACE ROUGHNESS; THERMOFORMING; THERMOPLASTICS; VACUUM APPLICATIONS;

GAS PRESSURE; LAB-ON-CHIP (LOC); MICROTHERMOFORMING; VACUUM SEALING;

POLYMERS;

EID: 9144224433     PISSN: 14781581     EISSN: None     Source Type: Journal    
DOI: 10.1049/ip-nbt:20040823     Document Type: Conference Paper

References (11)

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