Copper grain growth in reduced dimensions

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 48-50

  Brongersma, S H ^a   Vanstreels, K ^b   Wu, W ^a,c   Zhang, W ^a,c   Ernur, D ^a,c   D'Haen, J ^b   Terzieva, V ^a   Van Hove, M ^a   Clarysse, T ^a   Carbonell, L ^a   Vandervorst, W ^a   De Ceuninck, W ^b   Maex, K ^a,c  

^a IMEC   (Belgium)

^b HASSELT UNIVERSITY   (Belgium)

^c UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC SURFACE WAVE DEVICES; CHEMICAL MECHANICAL POLISHING; GRAIN BOUNDARIES; GROWTH (MATERIALS); INTERCONNECTION NETWORKS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR MATERIALS; STRUCTURE (COMPOSITION);

INTERCONNECT LINES; LINE RESISTANCE; SELF-IONIZED PLASMA (SIP); SPREADING RESISTANCE PROBE (SRP);

COPPER;

EID: 8744309968     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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