Microscale laser shock peening of thin films, part 2: High spatial resolution material characterization

Journal of Manufacturing Science and Engineering

Volumn 126, Issue 1, 2004, Pages 18-24

  Zhang, Wenwu ^a,c   Yao, Y Lawrence ^a   Noyan, I C ^b  

^a Columbia University ^*  (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c GE GLOBAL RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; FAILURE ANALYSIS; LASERS; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; SILICON; STRESS CONCENTRATION; THERMAL EFFECTS; WEAR RESISTANCE; X RAY DIFFRACTION;

LASER SHOCK PEENING (LSP); NANOINDENTATION; SHOCK TREATMENT; X-RAY MICRODIFFRACTION;

THIN FILMS;

EID: 8744255411     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1645879     Document Type: Article

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