Heat shrinkable behavior and mechanical response of a low-density polyethylene/millable polyurethane/organoclay ternary nanocomposite

Macromolecular Rapid Communications

Volumn 25, Issue 21, 2004, Pages 1851-1855

  Mishra, Joy K ^a   Kim, Il ^a   Ha, Chang Sik ^a  

^a Pusan National University   (South Korea)

Author keywords

Clay; Heat shrinkability; Nanocomposites; Polyethylene (PE); Polyurethanes

Indexed keywords

FILLERS; NANOSTRUCTURED MATERIALS; SHRINKAGE; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

MECHANICAL RESPONSE; NANOCOMPOSITES; ORGANOCLAYS;

LOW DENSITY POLYETHYLENES;

POLYETHYLENE; POLYURETHAN;

ARTICLE; CLAY; COMPOSITE MATERIAL; CROSS LINKING; DENSITY; GLASS TRANSITION TEMPERATURE; NANOPARTICLE; TENSILE STRENGTH; THERMOSTABILITY; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION; YOUNG MODULUS;

EID: 8744251329     PISSN: 10221336     EISSN: None     Source Type: Journal    
DOI: 10.1002/marc.200400364     Document Type: Article

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