High temperature, high power density packaging for automotive applications

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 1, Issue , 2003, Pages 425-430

  Gerber, M ^a   Ferreira, J A ^a   Hofsajer, I W ^b   Seliger, N ^c  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b UNIVERSITY OF JOHANNESBURG   (South Africa)

^c SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE ENGINEERING; HEAT SINKS; HIGH TEMPERATURE EFFECTS; POWER ELECTRONICS;

HIGH POWER DENSITY PACKAGING;

ELECTRONICS PACKAGING;

EID: 0042158207     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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6. nd International Conference, Page(s): 35-43
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8. M. Gerber; J.A. Ferreira; I.W. Hofsajer; N. Seliger, "A Very High Density, Heatsink Mounted Inductor for Automotive Applications," Industry Applications Conference, 2002. 37th IAS Annual Meeting. Conference Record of the, Volume: 2, 2002 Page(s): 948 -954 vol.2
9. Massoud Kaviany, "Principles of heat transfer," ISBN 0-471-43463-9, Chapters 1, 2, 3 and 8.