On-wafer de-embedding techniques for SiGe/BiCMOS/RFCMOS transmission line interconnect characterization

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 166-168

  Tretiakov, Youri ^a   Vaed, Kunal ^b   Ahlgren, David ^b   Rascoe, Jay ^a   Venkatadri, Sonal ^a   Woods, Wayne ^a  

^a IBM MICROELECTRONICS   (United States)

^b IBM   (United States)

Author keywords

De embedding; On wafer measurements; S parameters; Transmission line interconnects

Indexed keywords

DE-EMBEDDING; DEVICE CHARACTERIZATION; ON-WAFER MEASUREMENTS; TRANSMISSION LINE INTERCONNECTS;

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; EMBEDDED SYSTEMS; OPTICAL INTERCONNECTS; SCATTERING PARAMETERS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; WAVEGUIDES;

ELECTRIC LINES;

EID: 8644276449     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. D. C. Laney, Modulation, coding and RF components for ultra-wideband impulse radio, PhD thesis, University of California, San Diego, 2003.
2. L. F. Tiemeijer, R. J. Havens, "A calibrated lumped-element deembedding technique for on-wafer RF characterization of high-quality inductors and high-speed transistors," IEEE Transactions on Electron Devices, Vol. 50, No. 3, March 2003, pp. 823-829.
3. http://eesof.tm.agilent.com/products/e8921a-a.html
4. W. R. Eisenstadt, Y. Eo, "S-parameter-based IC interconnect transmission line characterization," IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 15, No. 4, August 1992, pp. 483-490.
5. M. C. A. M. Koolen, J. A. M. Geelen, M. P. J. G. Versleijen, "An improved de-embedding technique for on-wafer high frequency characterization", in 1991 BCTM Symposium Digest of Technical Papers, pp. 188-191.