Scaling relations for piezoresistive microphones

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 2000-AB, Issue , 2000, Pages 241-248

  Saini, Rahul ^a,b   Bhardwaj, Sunil ^a,b   Nishida, Toshikazu ^a,b   Sheplak, Mark ^a,b  

^a Interdisciplinary Microsystems Group

^b University of Florida   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIAPHRAGMS; STRESS ANALYSIS;

CIRCULAR DIAPHRAGMS; COMPREHENSIVE MODELING; IN-PLANE STRESS; MECHANICAL; PIEZO-RESISTIVE; PLANE STRESS LOADING; PLANES TRANSVERSE; SCALING RELATIONS; STRUCTURAL CHARACTERISTICS; TRANSVERSE LOADING;

MICROPHONES;

EID: 85119987984     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2000-1098     Document Type: Conference Paper

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