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Volumn , Issue , 2003, Pages 217-222
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Reducing Power Density through Activity Migration
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Author keywords
Activity Migration; Temperature Reduction; Thermal Model
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Indexed keywords
BUFFER STORAGE;
COMPUTER SIMULATION;
ELECTRIC CONDUCTIVITY;
ELECTRIC POTENTIAL;
HEAT RESISTANCE;
LEAKAGE CURRENTS;
MATHEMATICAL MODELS;
SEMICONDUCTOR JUNCTIONS;
SMART CARDS;
THERMODYNAMIC PROPERTIES;
TRANSISTORS;
ACTIVITY MIGRATION;
TEMPERATURE REDUCTION;
THERMAL MODEL;
MICROPROCESSOR CHIPS;
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EID: 85088185592
PISSN: 15334678
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1145/871506.871561 Document Type: Conference Paper |
Times cited : (17)
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References (12)
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