Wafer applied underfill - Delivering flip chip to the mainstream

SAE Technical Papers

Volumn , Issue , 2002, Pages

  Chaudhuri, Arun K ^a   Walsh, Matthew R ^a   Stepniak, Frank ^a   Post, Scott ^a   Zenner, Robert L D ^b   Kropp, Michael A ^b   Charles, Scott B ^b   Kinney, Robert B ^b   Li, F Bruce ^b  

^a DELPHI CORPORATION   (United States)

^b 3M COMPANY   (United States)

Author keywords

adhesive; flip chip; flux; no flow; underfill; wafer applied

Indexed keywords

ADHESIVES; ASSEMBLY; CHIP SCALE PACKAGES; CLEANING; FLIP CHIP DEVICES; FLUXES; PROCESS MONITORING;

AUTOMOTIVE APPLICATIONS; FLIP CHIP; LAMINATE SUBSTRATES; NO FLOWS; UNDERFILLS; VEHICLE ELECTRONICS; WAFER APPLIED UNDERFILL; WAFER-APPLIED;

SUBSTRATES;

EID: 85072503058     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/2002-01-1050     Document Type: Conference Paper

References (2)

1. Witty MR, Sellers RL, Rosson JM, Walker GG, Meehan MP, Vadas RL, Ward DK,. Flip Chip Assembly on rigid organic laminates. Proc. Int. Conf Multichip Modules, MCM 98, April 1998.
2. Charles S., Kropp M., Kinney R., Hackett S., Zenner R., Li F., Mader R., Hogerton P., Chaudhuri A., Stepniak F., Walsh M., Pre-Applied Underfill Adhesives for Flip Chip Attachment, to be published in the Proceedings of IMAPS Conference, October, 2001.