The application of 3-D electronic speckle pattern interferometry in assembly process of bolted joints

SAE Technical Papers

Volumn , Issue , 2005, Pages

  Nassar, Sayed A ^a   Meng, Aidong ^a   Yang, Lianxiang ^a  

^a Oakland University   (United States)

Author keywords

bolted joint; deformation; electronic speckle pattern interferometry; ; oint assembly; speckle interferometry; strain; stress

Indexed keywords

BOLTED JOINTS; BOLTS; DAMAGE DETECTION; DEFORMATION; INTERFEROMETRY; STRAIN; STRESSES;

ASSEMBLY PROCESS; CONTROL ACCURACY; DEFORMATION FIELD; DEFORMATION MEASUREMENTS; ELECTRONIC SPECKLE PATTERN INTERFEROMETRY; IN-PLANE DEFORMATION; SPECKLE INTERFEROMETRY; TENSION CONTROLS;

SPECKLE;

EID: 85072479139     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/2005-01-0896     Document Type: Conference Paper

References (6)

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