Strain measurement by three-dimensional electronic speckle pattern interferometry: Potentials, limitations, and applications

Optical Engineering

Volumn 42, Issue 5, 2003, Pages 1257-1266

  Yang, Lianxiang ^a   Ettemeyer, Andreas ^b  

^a Oakland University   (United States)

^b Ettemeyer AG   (Germany)

Author keywords

Deformation; Electronic speckle pattern interferometry; Full field measurement; Shape; Speckle interferometry; Strain; Stress

Indexed keywords

GLASS FIBERS; INTERFEROMETRY; OPTICAL TESTING; SPECKLE; STRESS ANALYSIS;

SPECKLE INTERFEROMETRY;

STRAIN MEASUREMENT;

EID: 0038380735     PISSN: 00913286     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.1566781     Document Type: Article

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