Combination of MCM-C technology with MCM-D technology using photosensitive polymers

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 63-68

  Topper M ^a   Scherpinski, K ^a   Hahn, R ^b   Ehrmann, O ^a   Reichl, H ^a   Schmaus, Ch ^c   Bechtold, F ^c  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b FRAUNHOFER IZM   (Germany)

^c Fa Siegert Electronic GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CHIP SCALE PACKAGES; FILM PREPARATION; LIGHT SENSITIVE MATERIALS; METALLIZING; MICROSTRIP LINES; PACKAGING MATERIALS; PHOTOSENSITIVITY; POLYMER FILMS; SUBSTRATES; THICK FILMS; THIN FILMS; COPPER; MULTICHIP MODULES; ORGANIC POLYMERS; PERMITTIVITY; RELIABILITY; THERMAL CYCLING;

CERAMIC SUBSTRATES; COMBINED TECHNOLOGY; DEVELOPMENT PROCESS; HIGH-DENSITY INTERCONNECTION; LOW DIELECTRIC CONSTANTS; MULTILAYER CERAMICS; PHOTOSENSITIVE POLYMERS; THIN FILM METALLIZATION;

INTERFACES (MATERIALS); ELECTRONICS PACKAGING;

HIGH DENSITY INTERCONNECTION LAYER; PHOTOSENSITIVE POLYMERS; PLANARIZATION; VIA FORMATION;

EID: 0032230562     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664435     Document Type: Conference Paper

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