Improving microprocessor performance with flip chip package designs

Proceedings - 1998 IEEE Symposium on IC/Package Design Integration, IPDI 1998

Volumn 1998-February, Issue , 1998, Pages 1-6

  Zu, Larry ^a   Joshi, Madhukar ^a   Houghton, Chris ^a   Loughlin, Bruce ^a   Vaccaro, Greg ^a   Dietz, Joel ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; PACKAGING; STATISTICAL METHODS;

ELECTRICAL MODELING; FLIP-CHIP PACKAGES; FLIP-CHIP PACKAGING; PRODUCT DEVELOPMENT PHASIS; WIRE BONDS;

MICROPROCESSOR CHIPS;

EID: 85036656538     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPDI.1998.663632     Document Type: Conference Paper

References (3)

1. Intel Corporation, "Focus Moore's Law: Changing the PC Platform for Another 20 Years", Online, http://developer.intel.com/soltions/archive/issue2/focus .htm
2. Hassan Hashemi and Dennis J. Herrell, "Power Distribution Fidelity of Wirebond Compared to Flip Chip Devices in Grid Array Packages", IEEE Trans. On Components, Packaging, and Manufacturing Technology-Part B. Vol. 20, No. 3, August 1997, pp.272-278.
3. Bruce A. Gieseke et al, "A 600 MHz Superscalar RISC Microprocessor with Out-Of-Order Execution", IEEE Internal Solid-State Circuit Conference, Digest of Technical Papers, Vol. 40, 1997, pp.176-177.