A flexible encapsulated MEMS pressure sensor system for biomechanical applications

Microsystem Technologies

Volumn 7, Issue 2, 2001, Pages 55-62

  Lee, Neville K S ^a   Goonetilleke, Ravindra S ^a   Cheung, Y S ^a   So, Geommi M Y ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BIOMECHANICS; HYSTERESIS; POLYMER FILMS; POLYMERS; PRESSURE MEASUREMENT;

BIOMECHANICAL APPLICATION; CONDUCTIVE POLYMER; CONDUCTIVE POLYMER FILMS; LOW HYSTERESIS; MEMS PRESSURE SENSOR; MICRO ELECTROMECHANICAL SYSTEM (MEMS); PERFORMANCE CHARACTERISTICS; PRESSURE READING;

PRESSURE SENSORS;

EID: 85023774535     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420100092     Document Type: Article

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