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Volumn 9, Issue 16, 2017, Pages 5072-5084

3D-printable, highly conductive hybrid composites employing chemically-reinforced, complex dimensional fillers and thermoplastic triblock copolymers

Author keywords

[No Author keywords available]

Indexed keywords

BLOCK COPOLYMERS; CARBON; CONDUCTIVE MATERIALS; ELECTRODES; FILLERS; PLASTICS; POLYSTYRENES; REINFORCED PLASTICS; REINFORCEMENT; SILVER; SUBSTRATES; TEMPERATURE; YARN;

EID: 85018791622     PISSN: 20403364     EISSN: 20403372     Source Type: Journal    
DOI: 10.1039/c6nr09610g     Document Type: Article
Times cited : (61)

References (44)
  • 36
    • 85051495540 scopus 로고    scopus 로고
    • CRC Press, Taylor & Francis Group, FL
    • M. N. Rahaman, Ceramic Processing, CRC Press, Taylor & Francis Group, FL, 2007
    • (2007) Ceramic Processing
    • Rahaman, M.N.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.