Electrodeposition-based 3D Printing of Metallic Microarchitectures with Controlled Internal Structures

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Volumn 11, Issue 32, 2015, Pages 3896-3902

  Seol, Seung Kwon ^a,b   Kim, Daeho ^a,b   Lee, Sanghyeon ^a,c   Kim, Jung Hyun ^a   Chang, Won Suk ^a,c   Kim, Ji Tae ^d  

^a Korea Electrotechnology Research Institute (KERI)   (South Korea)

^b University of Science and Technology (UST)   (South Korea)

^c Hanyang University   (South Korea)

^d MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

Author keywords

3D printing; electrodeposition; evaporation induced convective flow; meniscus; microarchitectures

Indexed keywords

COMPUTER ARCHITECTURE; ELECTRIC POTENTIAL; ELECTRODEPOSITION; ELECTRODES; HEAT CONVECTION; METAL IONS; METALS; PRINTING;

3-D PRINTING; AMBIENT AIR CONDITIONS; CONVECTIVE FLOW; INTERNAL STRUCTURE; MENISCUS; METAL ION CONCENTRATION; MICRO ARCHITECTURES; ROOM TEMPERATURE;

3D PRINTERS;

EID: 84939573500     PISSN: 16136810     EISSN: 16136829     Source Type: Journal    
DOI: 10.1002/smll.201500177     Document Type: Article

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