Thickness and composition measurement for thin film with combined X-ray technique

10th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, ASMC 1999

Volumn , Issue , 1999, Pages 414-419

  Terada, S ^a   Murakami, H ^b   Nishihagi, K ^a   Noshiro, H ^a   Horii, Y ^b  

^a Technos Co Ltd   (Japan)

^b FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FERROELECTRIC FILMS; FILM CAPACITOR; FILM PREPARATION; FILM THICKNESS; FLUORESCENCE; LEAD; MANUFACTURE; MULTILAYER FILMS; SEMICONDUCTOR DEVICE MANUFACTURE; THICKNESS MEASUREMENT; X RAY APPARATUS;

COMPOSITION MEASUREMENTS; FERRO-ELECTRIC RAMS; HIGH-PRECISION MEASUREMENT; INTERFERENCE METHODS; SIMULTANEOUS MEASUREMENT; SURFACE SENSITIVE METHODS; THIN FILM MATERIAL; X-RAY REFLECTIVITY MEASUREMENTS;

THIN FILMS;

EID: 85013567971     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.1999.798305     Document Type: Conference Paper

References (3)

1. S. Terada, "X-ray Interference Method-New Metrology Tool for Film on Wafers", in proceedings of SEMI Technology Symposium, 1998, pp. 7-86-7-93.
2. K. Hieda et. al. , "All Perovskite Capacitor (APEC) Technology for (Ba, Sr)Ti03 Capacitor Scaling toword 0. lOum Stacked DRAMS" in technical digest of International Electron Devices Meeting, 1998, pp. 807-810.
3. S. Terada et. al, Composition Analysis of BST /SRO Stacked Films by GIXRF, presented at Denver X-ray Conference, Steamboat Springs, 1999