Creep properties and microstructure of the SN-AG-CU-NI-GE lead-free solder alloy

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART C, Issue , 2006, Pages 1805-1810

  Hidaka, Noboru ^a   Nagano, Megumi ^a   Shimoda, Masayoshi ^a   Watanabe, Hirohiko ^a   Ono, Masahiro ^a  

^a FUJI ELECTRIC CO   (Japan)

Author keywords

Creep; Lead free solder; Microstructure; Precipitate; Sn 3.5Ag 0.5Cu 0.07Ni 0.01Ge

Indexed keywords

CREEP; MECHANICAL PROPERTIES; MICROSTRUCTURE; OXIDATION; TIN ALLOYS;

LEAD-FREE SOLDER; PRECIPITATE;

SOLDERING ALLOYS;

EID: 32844473498     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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