Copper Via Filling Electrodeposition of High Aspect Ratio Through Chip Electrodes Used for the Three Dimensional Packaging

journal of the japan institute of Electronics Packaging

Volumn 6, Issue 7, 2006, Pages 596-601

  Kondo, Kazuo ^a   Okamura, Takuji ^a   Jin Oh, Seung ^a   Yonezawa, Toshihiro ^a   Tomisaka, Manabu ^b   Yonemura, Hitoshi ^b   Hoshino, Masataka ^b   Taguchi, Yuichi ^b   Takahashi, Kenji ^b  

^a OKAYAMA UNIVERSITY   (Japan)

^b ASET   (Japan)

Author keywords

Additives; Electrodeposition; Pulse Reverse Current; Three Dimensional Packaging; Through Chip Electrode; Via Filling

Indexed keywords

EID: 85009535675     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.6.596     Document Type: Article

References (7)

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