Design and assembly of power semiconductors with double-sided water cooling

2008 5th International Conference on Integrated Power Systems, CIPS 2008

Volumn , Issue , 2008, Pages

  Schneider Ramelow, Martin ^a   Baumann, Thomas ^a   Hoene, Eckart ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACTS (FLUID MECHANICS); COOLING; DUCTS; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); LIQUIDS; MECHANICAL STABILITY; POWER SEMICONDUCTOR DEVICES; POWER SEMICONDUCTOR DIODES; SEMICONDUCTOR DIODES; SINTERING; SURFACE RESISTANCE;

ASSEMBLY TECHNOLOGY; CURRENT CARRYING CAPABILITY; DESIGN AND ASSEMBLIES; ENCAPSULATION TECHNOLOGY; POWER SEMICONDUCTORS; PRODUCTION PROCESS; THERMAL DISSIPATION; THERMAL-MECHANICAL RELIABILITY;

SUBSTRATES;

EID: 84991260897     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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