PowerRibbon™ - An alternative interconnect technology for small power packages

Proceedings - 2006 International Symposium on Microelectronics, IMAPS 2006

Volumn , Issue , 2006, Pages 435-443

  Luechinger, Christoph ^a   Oftebro, Kristian ^a   Hauniami, Siegbeit ^a  

^a Orthodvne Electronics Coiporation   (United States)

Author keywords

Aluminum; Powerribbon ; PQFN; Ribbon bonding; Small power package; SO 8

Indexed keywords

DESIGN CONSIDERATIONS; ELECTRICAL PERFORMANCE; INTERCONNECT TECHNOLOGY; POWER PACKAGE; POWER SEMICONDUCTORS; PQFN; PROCESS CAPABILITY DATA; SO-8;

ALUMINUM; COPPER; COSTS; DIGITAL STORAGE; MICROELECTRONICS; POWER ELECTRONICS;

WIRE;

EID: 84876563721     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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