Thermal stability of a Ti-Si-N diffusion barrier in contact with a Ti adhesion layer for Au metallization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 1, 1999, Pages 166-173

  Shalish, Ilan ^a   Shapira, Yoram ^a  

^a TEL AVIV UNIVERSITY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84976384272     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590531     Document Type: Article

References (15)

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