2D heat dissipation materials for microelectronics cooling applications

China Semiconductor Technology International Conference 2016, CSTIC 2016

Volumn , Issue , 2016, Pages

  Zhang, Yong ^a,b   Huang, Shirong ^a   Wang, Nan ^b   Bao, Jie ^a   Sun, Shuangxi ^a,b   Edwards, Michael ^b   Fu, Xuan ^a   Yue, Wang ^a   Lu, Xiuzhen ^a   Zhang, Yan ^a   Yuan, Zhichao ^a   Han, Haoxue ^c,d   Volz, Sebastian ^c,d   Fu, Yifeng ^b,e   Ye, Lilei ^e   Jeppson, Kjell ^a,b   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^c LABORATOIRE EM2C   (France)

^d ECOLE CENTRALE PARIS   (France)

^e SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

BORON NITRIDE; CHARACTERIZATION; CHIP SCALE PACKAGES; COOLING; FILMS; GRAPHENE; HEAT FLUX; HEATING EQUIPMENT; MICROELECTRONICS; MONOLAYERS; NITRIDES; SEMICONDUCTOR DEVICE MANUFACTURE; SPREADERS; TEMPERATURE MEASURING INSTRUMENTS;

HEXAGONAL BORON NITRIDE; MICRO ELECTRONICS COOLING; MICROELECTRONIC COMPONENTS; PACKAGING STRUCTURE; RESISTANCE TEMPERATURE DETECTORS; TECHNOLOGICAL DEVELOPMENT; THERMAL CHARACTERIZATION; THERMAL PERFORMANCE;

HEAT RESISTANCE;

EID: 84974577465     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CSTIC.2016.7463960     Document Type: Conference Paper

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