Heterogeneously assembled metamaterials and metadevices via 3D modular transfer printing

Scientific Reports

Volumn 6, Issue , 2016, Pages

  Lee, Seungwoo ^a   Kang, Byungsoo ^b   Keum, Hohyun ^c   Ahmed, Numair ^c   Rogers, John A ^c   Ferreira, Placid M ^c   Kim, Seok ^c   Min, Bumki ^b  

^a Sungkyunkwan University   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^c University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PRINTING;

EID: 84974555607     PISSN: None     EISSN: 20452322     Source Type: Journal    
DOI: 10.1038/srep27621     Document Type: Article

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