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Volumn , Issue , 2006, Pages

Failure mechanisms in SiC power module interconnects

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER SYSTEMS; FAILURE (MECHANICAL); SILICON CARBIDE; STRESSES;

EID: 84971425233     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (10)
  • 2
    • 0026378022 scopus 로고
    • A numerical and experimental study of temperature cycle wire bond failure
    • May 13-15
    • Chidambaram, N. V., 1991, "A Numerical and Experimental Study of Temperature Cycle Wire Bond Failure", CHMT/IEEE Conference, May 13-15, pp 877-882.
    • (1991) CHMT/IEEE Conference , pp. 877-882
    • Chidambaram, N.V.1
  • 3
    • 1242287095 scopus 로고    scopus 로고
    • Wire flexure Fatigue model for asymmetric bond height
    • Hawaii, July 6-11
    • K. Meyyappan, F. P. McCluskey, P. Hansen, "Wire flexure Fatigue model for asymmetric bond height", InterPACK 2003, Hawaii, July 6-11, 2003.
    • (2003) InterPACK 2003
    • Meyyappan, K.1    McCluskey, F.P.2    Hansen, P.3
  • 4
    • 1942536527 scopus 로고    scopus 로고
    • Wire fatigue models for power electronic modules
    • Washington DC, Nov 15-21
    • K. Meyyappan, F. P. McCluskey, F., P. Hansen, "Wire Fatigue Models for Power Electronic Modules", IMECE 2003, Washington DC, Nov 15-21, 2003.
    • (2003) IMECE 2003
    • Meyyappan, K.1    McCluskey F, F.P.2    Hansen, P.3
  • 5
    • 84971376023 scopus 로고    scopus 로고
    • Failure analysis on direct bonded copper substrates after thermal cycle in different mounting conditions
    • J., Mikkelsen, "Failure Analysis on Direct Bonded Copper Substrates after Thermal cycle in different Mounting conditions", PCIM 2001.
    • PCIM 2001
    • Mikkelsen, J.1
  • 6
    • 0024056874 scopus 로고
    • On the decohesion of residually stressed thin films
    • M. D. Drory, M. D. Thouless, and A. G. Evans, "On The Decohesion of Residually Stressed Thin Films", Acta Metall., v. 36, n.8, pp. 2019-2028, 1988
    • (1988) Acta Metall. , vol.36 , Issue.8 , pp. 2019-2028
    • Drory, M.D.1    Thouless, M.D.2    Evans, A.G.3
  • 7
    • 0018444760 scopus 로고
    • Thermal Stresses in bonded joints
    • W. T. Chen, C. W. Nelson, "Thermal Stresses in bonded joints", IBM J. of R&D., Vol. 23 (2), pp. 179-188, 1979.
    • (1979) IBM J. of R&D. , vol.23 , Issue.2 , pp. 179-188
    • Chen, W.T.1    Nelson, C.W.2
  • 8
    • 0023172974 scopus 로고
    • Die attachment design and its influence on thermal stresses in the die and the attachment
    • E. Suhir, "Die Attachment Design And Its Influence On Thermal Stresses In The Die And The Attachment", Proceedings Of 37th Electronic Components Conference, pp. 508-517, 1987
    • (1987) Proceedings of 37th Electronic Components Conference , pp. 508-517
    • Suhir, E.1
  • 10
    • 1942440390 scopus 로고    scopus 로고
    • Wire bond failures in power modules
    • Washington DC, Nov 15-21
    • S. Ramminger, G. Wachutka, "Wire Bond Failures in Power Modules", IMECE 2003, Washington DC, Nov 15-21, 2003.
    • (2003) IMECE 2003
    • Ramminger, S.1    Wachutka, G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.