BLOΚ™ - A Low-K dielectric barrier/etch stop film for copper damascene applications

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 109-111

  Xu, Ping ^a   Huang, Kegang ^a   Patel, Anjana ^a   Rathi, Sudha ^a   Tang, Betty ^a   Ferguson, John ^a   Huang, Judy ^a   Ngai, Chris ^a   Loboda, Mark ^b  

^a APPLIED MATERIALS INC   (United States)

^b DOW CORNING CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS CARBON; AMORPHOUS FILMS; AMORPHOUS SILICON; CARBON; COPPER; DIELECTRIC MATERIALS; INTEGRATED CIRCUIT INTERCONNECTS; SILICON CARBIDE; SILICON COMPOUNDS; SILICON NITRIDE; SILICON WAFERS;

CARBON AND HYDROGENS; COPPER DAMASCENE; COPPER DAMASCENE PROCESS; COPPER DIFFUSION BARRIER; DIELECTRIC BARRIER; ETCH SELECTIVITY; FILM CHARACTERIZATIONS; LOW DIELECTRIC CONSTANTS;

LOW-K DIELECTRIC;

EID: 84966678073     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787093     Document Type: Conference Paper

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