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Journal of Japan Institute of Electronics Packaging
Volumn 3, Issue 7, 2000, Pages 621-626
A New Ara of System Integration and Packaging
Author keywords

[No Author keywords available]
Indexed keywords

EID: 84966646389     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.3.621     Document Type: Article
Times cited : (2)
References (3)
  • 1
    • 0342428119 scopus 로고    scopus 로고
    • International Technology Roadmap for Semiconductors
    • 1999 Edition
    • “International Technology Roadmap for Semiconductors”. 1999 Edition, The Semiconductor Industry Association, 1999.
    • (1999) The Semiconductor Industry Association
  • 2
    • 0034476042 scopus 로고    scopus 로고
    • A Measurement and Simulation Study of Transmission Lines on Micro-Strip and Stacked-Pair Structure for High Speed Signals
    • May 21-24. Las Vegas
    • Yasuhiko Odate, Tamotsu Usami, Kanji Otsuka, Tadatomo Suga : “A Measurement and Simulation Study of Transmission Lines on Micro-Strip and Stacked-Pair Structure for High Speed Signals”. Proc. Electronic Components & Technology Conference. May 21-24. 2000, Las Vegas, pp.526-529. 2000.
    • (2000) Proc. Electronic Components & Technology Conference. , vol.2000 , pp. 526-529
    • Odate, Y.1    Usami, T.2    Otsuka, K.3    Suga, T.4
  • 3
    • 0034476478 scopus 로고    scopus 로고
    • Environmentally Sound CSP Using Wire Separation Technology
    • May 21-24, Las Vegas
    • Masanori Onodera, Tadatomo Suga : “Environmentally Sound CSP Using Wire Separation Technology”, Proc. Electronic Components & Technology Conference, May 21-24, 2000, Las Vegas, pp.1623-1628, 2000
    • (2000) Proc. Electronic Components & Technology Conference , vol.2000 , pp. 1623-1628
    • Onodera, M.1    Suga, T.2

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.