Environmentally sound CSP using wire separation technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1623-1628

  Onodera, Masanori ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; ETCHING; HEATING; SUBSTRATES; SURFACES; THERMAL EFFECTS;

BONDING TECHNOLOGY; WIRE SEPARATION TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 0034476478     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)