-
1
-
-
0029408179
-
High frequency noise of bipolar devices in consideration of carrier heating and low temperature effects
-
November
-
F. Herzel and B. Heinemann, "High frequency noise of bipolar devices in consideration of carrier heating and low temperature effects," Solid-state Electronics, vol. 38, pp. 1905-1909, November 1995.
-
(1995)
Solid-state Electronics
, vol.38
, pp. 1905-1909
-
-
Herzel, F.1
Heinemann, B.2
-
2
-
-
0031236647
-
A scalable high-frequency noise model for bipolar transistors with application to optimal transistor sizing for low-noise amplifier design
-
September
-
S.P. Voinigescu, M.C. Maliepaard, J.L. Showell, G.E. Babcock, D. Marchesan, M. Schroter, P. Schvan, and D.L. Harame," A scalable high-frequency noise model for bipolar transistors with application to optimal transistor sizing for low-noise amplifier design," IEEE Journal of Solid-state Circuits, vol. 32, pp. 1430-1438, September 1997.
-
(1997)
IEEE Journal of Solid-state Circuits
, vol.32
, pp. 1430-1438
-
-
Voinigescu, S.P.1
Maliepaard, M.C.2
Showell, J.L.3
Babcock, G.E.4
Marchesan, D.5
Schroter, M.6
Schvan, P.7
Harame, D.L.8
-
4
-
-
0029276715
-
Si/SIGeepitaxial-base Transistors-Part I: Materials, Physics, and Circuits
-
March
-
D.L. Harame, J.H. Comfort, J.D. Cressler, E.F. CrabbC, J.Y.C. Sun, B.S. Meyerson, T. Tice, 'Si/SIGeepitaxial-base transistors-Part I: Materials, physics, and circuits," ZEEE Trans. Electron Devices, vol. 42, pp. 469-482, March 1995.
-
(1995)
ZEEE Trans. Electron Devices
, vol.42
, pp. 469-482
-
-
Harame, D.L.1
Comfort, J.H.2
Cressler, J.D.3
CrabbC, E.F.4
Sun, J.Y.C.5
Meyerson, B.S.6
Tice, T.7
-
5
-
-
0031353281
-
A SiGe HBT BiCMOS technology for mixed signal RF applications
-
September
-
D.C. Ahlgren, G. Freeman, S. Subbanna, R. Groves, D. Greenberg, J. Malinowski, D. Nguyen-Ngoc, S.J. Jeng, K. Stein, K. Schonenberg, D. Kiesling, B. Martin, S. Wu, D.L. Harame, and B. Meyerson, "A SiGe HBT BiCMOS technology for mixed signal RF applications," Proc. IEEE BCTM, pp. 195-198, September 1997.
-
(1997)
Proc IEEE BCTM
, pp. 195-198
-
-
Ahlgren, D.C.1
Freeman, G.2
Subbanna, S.3
Groves, R.4
Greenberg, D.5
Malinowski, J.6
Nguyen-Ngoc, D.7
Jeng, S.J.8
Stein, K.9
Schonenberg, K.10
Kiesling, D.11
Martin, B.12
Wu, S.13
Harame, D.L.14
Meyerson, B.15
-
6
-
-
0030241175
-
An improved SPICE model for high frequency noise of BJT's and HBT's
-
September
-
U. Zillmann and F. Herzel, "An improved SPICE model for high frequency noise of BJT's and HBT's," IEEE Journal ofSolid-State Circuits, vol. 3 1, pp. 1344-1 346, September 1996.
-
(1996)
IEEE Journal OfSolid-State Circuits
, vol.3
, Issue.1
, pp. 1344-1346
-
-
Zillmann, U.1
Herzel, F.2
-
7
-
-
0031102366
-
Experimental verification and numerical application of the thermodynamic approach to high frequency noise in SiGe HBT's
-
March
-
F. Herzel, P. Schley, B. Heinemann, U. Zilmann, D. Knoll, D. Temmler, and U. Erben, "Experimental verification and numerical application of the thermodynamic approach to high frequency noise in SiGe HBT's," Solid-State Electronics, vol. 41, pp. 387-390, March 1997.
-
(1997)
Solid-State Electronics
, vol.41
, pp. 387-390
-
-
Herzel, F.1
Schley, P.2
Heinemann, B.3
Zilmann, U.4
Knoll, D.5
Temmler, D.6
Erben, U.7
|