Fine pitch copper wire bonding on copper bond pad process optimization

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, EMAP 2002

Volumn , Issue , 2002, Pages 63-68

  Lam, Kan Wai ^a   Ho, Hong Meng ^b   Stoukatch, S ^b   Van De Peer, M ^b   Ratchev, P ^b   Vath, C J ^c   Schervan, A ^a   Beyne, E ^b  

^a ASM International NV   (Netherlands)

^b IMEC   (Belgium)

^c ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; CHIP SCALE PACKAGES; COPPER; ELECTRONICS PACKAGING; GOLD; MODIFIED ATMOSPHERE PACKAGING; OPTIMIZATION; ORGANIC COATINGS; PACKAGING MATERIALS; SILVER; SUBSTRATES;

COPPER BONDS; COPPER WIRE BONDINGS; COPPER WIRES; FINE PITCH; FINE-PITCH APPLICATION; OXIDATION LEVEL; PROCESS PARAMETERS; THIN LAYERS;

WIRE;

EID: 84966605890     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2002.1188814     Document Type: Conference Paper

References (6)

1. L.A. Lim, Jimmy Castaneda, Shinji Shirakawa, "Fine Pitch Copper Wire Bonding Process and Materials Study", http://www.smallprecisiontools.com/Cu-wb.html
2. R. Binner, Tan Kah Weal, "Second Bond Consideration of Fine Pitch Copper Ball Bonding on BGA Substrates", http://www.smallprecisiontools.com
3. J. Nötzli, H Berchtold, F. van Mulken, "Copper Wire Ultra Fine Pitch Bonding - The Natural Progression In IC Assembly Technology?", http://www.smallprecisiontools.com
4. Hong M. Ho, K.W. Lam, S. Stoukatch, "Advanced Wire Bonding: Bonding On Copper", Proc European Microelectronics Packaging and Interconnection Symposium, Poland, June 2002
5. George G. Harman, "Wire Bonding in Microelectronics Materials, Processes, Reliability and Yield", 2d Ed., McGraw-Hill, New York, 1997.
6. P. Ratchev, L. Carbonell, H. M. Ho, I. De Wolf and B. Verlinden, "Orientation Imaging Microscopy Applications in Cu-Interconnect and Cu-Cu Wire bonding", accepted in 28th ISTFA, Phoenix, Arizona, 3-7 November 2002