Orientation Imaging Microscopy Applications in Cu- Interconnects and Cu-Cu Wire Bonding

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2002, Pages 61-66

  Ratchev, Petar ^a   Carbonell, Laureen ^a   Ho, Hong Meng ^a   Bender, Hugo ^a   De Wolf, Ingrid ^a   Verlinden, Bert ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER SOFTWARE; COPPER; CRYSTALLOGRAPHY; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; OPTICAL MICROSCOPY; OXIDATION; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY;

ORIENTATION IMAGING MICROSCOPY (OIM); WIRE BONDING;

OPTICAL INTERCONNECTS;

EID: 1542270317     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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