Fretting corrosion studies for lead-free alloy plated contacts

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 20-24

  Wu, Ji ^a   Pecht, M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; CONTACT RESISTANCE; COPPER; CORROSION; ELECTRONICS PACKAGING; ELECTROPLATING SOLUTIONS; FRETTING CORROSION; LEAD; LEAD ALLOYS; SOLDERED JOINTS; TIN; TIN OXIDES;

ELECTRICAL CHARACTERISTIC; ELECTRONIC INDUSTRIES; FINISH MATERIALS; FRETTING AMPLITUDE; MECHANICAL DEFORMATION; SEPARABLE CONNECTORS; TIN-LEAD SOLDERS; TIN-SILVER-COPPER;

LEAD-FREE SOLDERS;

EID: 84964668985     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185590     Document Type: Conference Paper

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