Accelerated testing of tin-plated copper alloy contacts

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 1, 1999, Pages 53-60

  Malucci, Robert D ^a,b  

^a IEEE

^b MOLEX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ALGORITHMS; COPPER ALLOYS; DEGRADATION; ELECTRIC CONNECTORS; FRETTING CORROSION; MATHEMATICAL MODELS; OXIDATION; STRESS RELAXATION; THERMAL CYCLING; THERMOANALYSIS; VIBRATIONS (MECHANICAL);

TEMPERATURE HUMIDITY CYCLING; TIN-PLATED COPPER ALLOY CONTACTS;

ELECTRIC CONTACTS;

EID: 0033316025     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.759353     Document Type: Article

References (14)

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