Integration and reliability of copper magnesium alloys for multilevel interconnects

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 236-238

  Braeckelmann, G ^a   Venkatraman, R ^a   Capasso, C ^a   Herrick, M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER ALLOYS; MAGNESIUM; MAGNESIUM ALLOYS;

DIFFUSION PROPERTIES; ELECTRICAL PERFORMANCE; ELECTROMIGRATION TESTING; INTERCONNECT STRUCTURES; MULTI LEVEL INTERCONNECTS; STATE OF THE ART; TEST STRUCTURE;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84962921312     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854335     Document Type: Conference Paper

References (4)

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2. (a)P.J. Ding, W. Lanford, S. Hymes, S. Murarka, Appl. Phys. Lett. 64, 2897 (1994);
3. (b) B. Arcot, L. Clevenger, S. Murarka, J. Harper, C. Cabral Jr., Mat. Res. Soc. Symp. Vol. 260, 947 (1992)
4. G. Braeckelmann, R. Venkatraman, M. Herrick, R. Cole, D. Clegg; to be presented at the Spring 2000 MRS conference