Interconnect metrology roadmap: Status and future

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 77-79

  Diebold, Alain C ^a   Goodall, Randal K ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL DETECTION; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; DIELECTRIC FILMS; UNITS OF MEASUREMENT;

COPPER METALLIZATION; CRITICAL DIMENSION; DAMASCENE PROCESSING; DEFECT DETECTION; INTERCONNECT STRUCTURES; INTERCONNECT TECHNOLOGY; MATERIALS AND PROCESS; ON-CHIP INTERCONNECTS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 85028875730     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787083     Document Type: Conference Paper

References (3)

1. Metrology Technical Working Group Report, AC Diebold and KA Monahan, co-chairs Metrology Technical Working Group, in: National Technology Roadmap for Semiconductors. Semiconductor Industry Association, 1997.
2. M. Melliar-Smith and A.C. Diebold, "Metrology Needs for the Semiconductor Industry Over the Next Decade", in Characterization and Metrology for ULSI Technology, D.G. Seiler, A.C. Diebold, M. Bullis, T.J. Shaffner, R. McDonald, and E.J. Walters Eds., (AIP Press, New York, 1998), pp 3-20.
3. Noel Poduje, ADE Corporation, private communication with RKG.