Smart label uses polymer thick film technology on low-cost substrates

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 314-318

  Luniak, Marco ^a   Monser, Hans Peter ^b   Brod, Volker ^b   Wolter, Klaus Jürgen ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b ASEM GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINUM FOIL; INTEGRATED CIRCUITS; SUBSTRATES; THICK FILMS;

SMART LABELS;

PLASTIC FILMS;

EID: 0035790696     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Klaus Finkenzeller: "RFID-Handbuch", München, Wien 2000.
2. Yahiha Haghiri, Thomas Tarantino: "Vom Plastik zur Chipkarte", München, Wien 1999.
3. Thomas H. Stearns: "Flexible Printed Circuitry", New York 1996.