Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 12-14

  Tada, M ^a   Harada, Y ^a   Hijioka, K ^a   Ohtake, H ^a   Takeuchi, T ^a   Saito, S ^a   Onodera, T ^a   Hiroi, M ^a   Furutake, N ^a   Hayashi, Y ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT INTERCONNECTS; NANOTECHNOLOGY; SILICA;

BENZOCYCLOBUTENE; DUAL DAMASCENE INTERCONNECTS; EFFECTIVE DIELECTRIC CONSTANTS; ETCH-STOP LAYERS; INTERCONNECT STRUCTURES; LOW-K FILMS; ORGANOSILICAS; SI-C-N FILMS;

COPPER;

EID: 84961751186     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014872     Document Type: Conference Paper

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