Characterization and integration of porous extra low-k (XLK) dielectrics

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 99-101

  Jin, Changming ^a   Wetzel, J ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; COPPER; DIELECTRIC FILMS; INTEGRATED CIRCUIT INTERCONNECTS; LOW-K DIELECTRIC;

CU DAMASCENE; DAMASCENE INTEGRATION; LEAKAGE CURRENT DISTRIBUTION; PARAMETRIC TEST; POROUS LOW-K MATERIAL;

DIELECTRIC MATERIALS;

EID: 84962798895     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854294     Document Type: Conference Paper

References (8)

1. S-P. Jeng, M. Chang, T. Kroger, P. McAnally, R. H. Havemann, 1994 VLSI Tech. Dig., pp 73-74.
2. W. W. Lee and P. S. Ho, MRS Bulletin 22, 19 (1997).
3. Semiconductor Industry Association, International Technology Roadmap for Semiconductors 1998 Update. SEMATECH, Austin, TX.
4. C. Jin, J. D. Luttmer, D. M. Smith, T. A. Ramos, MRS Bulletin 22, 39 (1997).
5. E.O. Shaffer, P. Townsend and J.-H. Im, 1997 MRS Conference Proceedings ULSI XII, 429.
6. W. L. Wu and H.-C. Liou, Thin Solid Films 312, 73 (1998).
7. J. S. Higgins and H. C. Benoit, Polymers and Neutron Scattering, Clarendon Press, Oxford UK, 1994.
8. D. G. Cahill, M. Katiyar, and J. R. Abelson, Phys. Rev. B50, 6077 (1994).