Low-resistivity PVD α-tantalum: Phase formation and integration in ultra-low k dielectric/copper damascene structures

Proceedings of the IEEE 2002 International Interconnect Technology Conference, IITC 2002

Volumn , Issue , 2002, Pages 179-181

  Donohue, H ^a   Gris, H ^a   Yeoh, J C ^a   Buchanan, K ^a  

^a Trikon Technologies   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; DIELECTRIC MATERIALS; LOW-K DIELECTRIC; REACTIVE SPUTTERING; TANTALUM;

DAMASCENE STRUCTURE; DEPOSITION TEMPERATURES; FILM PROPERTIES; LOW RESISTIVITY; LOW-K INTEGRATION; PHASE FORMATIONS; TANTALUM DIFFUSION; ULTRA LOW-K DIELECTRICS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84961720987     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2002.1014926     Document Type: Conference Paper

References (7)

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